Springer, 2005. — 228 p. — ISBN: 3540221093.
The manual is written for producers of sensors and microtechnical components but also for producers of components of precision engineering and optical applications. The intention is to support the extension of the application of silicon structures not only in the microtechnique but also in unconventional fields, this means a transfer of the advanced material base and technologies of the microtechnique into the precision engineering. The monocrystalline silicon is a very suitable material for a number of components because of its stable thermomechanical properties. The principles of microstructuring can be applied also for the production of relative large structures having the high precision which must be presupposed for microstructures.
Technological Basis of Bulk-Silicon-MicrotechniqueThe silicon wafer as a basis material of microtechnique
Technological processes
Orientation Dependent Etching of SiliconFundamental principles of the generation of shapes
Chemistry and techniques of wet silicon etching
Etch mask design and simulation of silicon etching
Basic processes of the bulk-silicon-microtechnique
General Overview of the Shape- and Functional Elements and the Procedure of their DesignSurvey and methodical procedure
Guide for the design procedure
Legend of the sketches
Simple Shape ElementsDefinitions of shapes by the combination of sidewalls
Qualities of etch ground and sidewall-faces and of the edges between them
Shape elements made by one-step etch processes
Shape elements made by two-step etch processes
Elements for Mechanical ApplicationsSpring elements
Levers / Spring hinges
Sliding guides
Bearings
Elements for Fluidic ApplicationsChannels
Alterations of cross section of channels
Elbows
Branchings (Mixers)
Caverns (Cavities)
Nozzles
Elements for Optical ApplicationsGrooves for fibre positioning
Micro mirrors
Beam Splitters
Concave Micro Mirrors
Gratings
Infrared Prisms
AppendixPhysical Properties of Silicon