Tong X.C. Advanced Materials for Thermal Management of Electronic Packaging

Springer, 2011. — 633 p. — (Springer Series in Advanced Microelectronics 30). — ISBN 13 9781441977588.Современные материалы для терморегулирования электронных корпусовThe need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Key Features
Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites
Provides the reader with a comprehensive understanding of thermal management solutions
Includes fundamentals of heat transfer and materials characterization techniques Assesses cost and performance in thermal managementThermal Management Fundamentals and Design Guides in Electronic Packaging
Characterization Methodologies of Thermal Management Materials
Electronic Packaging Materials and Their Functions in Thermal Managements
Monolithic Carbonaceous Materials and Carbon Matrix Composites
Thermally Conductive Polymer Matrix Composites
High Thermal Conductivity Metal Matrix Composites
Thermally Conductive Ceramic Matrix Composites
Thermal Interface Materials in Electronic Packaging
Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks
Liquid Cooling Devices and Their Materials Selection
Thermoelectric Cooling Through Thermoelectric Materials
Development and Application of Advanced Thermal Management Materials